－Easy operation: good construction before curing, moderate
operation time.

－Excellent resistance to high and low temperatures, can be
used under -50°C ~200°C after curing.

－Excellent electrical insulation performance, arc corona
resistance and impact resistance, long-term protection of
electronic components.

－Good water resistance, ozone resistance, excellent aging
resistance, can effectively prevent water vapor infiltration.

－Excellent flame retardant performance to ensure effective
heat dissipation of electronic modules.

－AB components should be stirred well before use, A: B= 1:1 (weight ratio),
and sealed into the substrate cavity. Room temperature curing until it forms
an elastomer. A, B components must be fully mixed to avoid uneven,
affecting the curing and performance of the glue.

－Components A and B are stored separately, now used, and must be used
up in a short time after preparation to avoid waste.

－The surface of the electronic module must be cleaned before use, and must
not contain N, P, S, heavy metals and their compounds.

－When applying primer, spray machine, roller or other coating tools can be
used to dip the primer and brush on the surface of the substrate. After
brushing, it needs to be placed for 30 minutes before sizing the substrate.